PCB Design
–Blind and buried vias
–Multi-lamination cycles
–Controlled impedance
–High speed digital, 18GHz+
–Radio Frequency
–Flex and Rigid Flex
–Back drilled vias
–Small pitch devices
–In circuit test (ICT)/Bed of nails
–Flying probe testability
–Class 3 designs
–DDR1, DDR2, DDR3, DDR4
–LVDS
–SATA
–DLP technology
–Wi-Fi
–Bluetooth
–Analog/Digital video or audio
–High current/High voltage
–Multiphase switching power supplies
–Ground isolation
–Backplanes
–Test Cards
–EVM/Reference Cards
–Motherboards with multiple processors
–EMI/Signal Integrity
–USB1/2/3/3.1
–SerDes
–Design for test (DFT)
–Linear/switching power supplies
PCB Tools
–Cadence Allegro
–Mentor Graphics PADS Layout
–OrCAD Layout
–Cadence Design Entry CIS(OrCAD)
–Mentor Graphics PADS Logic
–Mentor Graphics DxDesigner
